Our general tolerances for the most cost-effective manufacture of laser profiling:

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• Length and width between profiled edges: +/- 0.05 mm

• Profiled edge to hole centre: +/- 0.05 mm

• Narrowest cut (profiled) slot: 0.1 mm

• Corner radius: >/= substrate thickness (specify internal corner radii to minimise the risk of micro-cracking)

Our general tolerances for the most cost-effective manufacture of laser-scribed substrates:

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• Depth of scribing between 30 - 50% of the material thickness (or by arrangement)

• Laser pulse spacing normally +0.15/-0.02 mm from centreline to centreline (or by arrangement)

• Edge to design. The border edge to be snapped off should be at least 5 times the material thickness

• Distance between scribed edges: +0.15/-0.05mm

• Distance from laser-scribed/laser-profiled edge to first scribe line: +0.15/-0.05 mm

• Distance from scribe line to scribe line: +/- 0.05 mm

Our general tolerances for laser drilling:

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• Hole diameter: +/- 0.05 mm

• Hole tapers: ~ 5% of the substrate thickness

• Hole centre to hole centre: +/- 0.05 mm

• Wall thickness between adjacent holes:  >/= the substrate thickness

• Wall thickness between hole edge and another edge: >/= the substrate thickness

• Scribed edge to hole centre: +0.15/-0.05 mm

• Profiled edge to hole centre: +/- 0.05 mm

• Centre of scribed line to hole centre: +/- 0.05 mm